PolyDissolve™ S1

PolyDissolve™ S2 is a dissolvable support for PC, ABS and ASA based filaments from our portfolio. It is specifically engineered to have a perfect interface with these materials while also displaying good solubility.

PolyDissolve™ is a family of dissolvable support filaments. This family offers support solution for our portfolio of filaments. It enables a greater design freedom.

Available Colors:
 
Natural
Diameter Size:
 
1.75 mm, 2.85 mm
Net Weight:
 
500 g
Buy now
Specifications
Packaging
Technologies
Print Settings
Nozzle Temperature:
215˚C – 225˚C
Printing Speed:
30mm/s – 40mm/s
Bed Temperature
25˚C – 60˚C
Bed Surface:
Glass with glue, blue tape
Cooling Fan:
ON
Mechanical Properties
Young's Modulus:
Tensile Strength:
Elongation at Break:
Shore Hardness:
Bending Strength:
Charpy Impact:
Thermal Propertises
Glass Transition Temperature:
Vicat Softening Temperature:
Melting Temperature:
Notes
Drying Settings:
80˚C for 3h
Recommended Support Materials
30mm/s – 40mm/s
Other:
25˚C – 60˚C

Specifications
Packaging
Technologies
Print Settings
Compatible Material:
Maximum Part Size (Diameter*Height):
Polishing Liquid:
Polishing Time:
Operating Temperature
Storage Temperature:
Power Supply (INPUT):
Power Supply (OUTPUT):
Polysher™ INPUT:
Desiccant Type:
Humidity Range:
Resolution
Response
Temperature Range:
Battery specifications
Operation Manual:
Download